TDK贴片电容器

TDK株式会社开发出了业内**具有低ESR的软端子积层陶瓷贴片电容器。
 此次的新CN系列具有带导电树脂层的端子电极，从而可以提供高机械强
度以及防止基板翘曲。同时，该新款积层陶瓷贴片电容器具有与传统产品
相当的低ESR。CN 系列电容值为2.2 μF到22 μF ，额定电压为16 V到100
 V。以X7R介电材料为基础，该新款积层陶瓷贴片电容器的商用等级类型
和汽车等级类型均已上市。后者已通过AEC-Q200认证，而前者将从2018
年4月起已开始量产和销售。
带软端子的积层陶瓷贴片电容器能够耐受基
板翘曲产生的应力，是电池线路中防止短路的一种有效方法。传统设计
是在电极涂满树脂，但这样会导致较高的ESR和损耗。TDK仅在端子电极
与PCB接触的地方涂上导电树脂层，从而实现了较低的ESR。新款CN系列
的端子电极电阻较低，因此这些积层陶瓷贴片电容器适用于汽车和工业
机器人应用中的电池线路，有助于提高系统可靠性。该类电容器也可以
用于汽车ECU、先进驾驶辅助系统（ADAS）和自动驾驶系统中。TDK为种
类繁多的应用产品提供广泛的积层陶瓷贴片电容器产品组合。今后，TDK
也将继续特别关注在技术上拥有优势的汽车等级积层陶瓷贴片电容器的开
发。
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主要应用


汽车和工业机器人应用的电池线路
汽车ECU
先进驾驶辅助系
统（ADAS）、自动驾驶系统
主要特点和优势


低ESR，与传统积层陶瓷贴片
电容器相当
机械强度高，防止基板翘曲
通过AEC-Q200认证
主要数据